Liquid crystal display device having gate or data pad portions arranged in a zigzag or an oblique line format

ABSTRACT

A LCD device and its fabrication method as discussed. According to an embodiment, the LCD device includes a plurality of gate lines and data lines arranged on a substrate to define a plurality of unit pixels; thin film transistors (TFTs) each formed at an intersecting region of the gate lines and the data lines; a plurality of gate pad portions and data pad portions formed at end portions of the gate lines and the data lines, respectively, at least one of the gate and data pad portions being made up of at least two pad unit portions, each pad unit portion having at least one contact hole such that the contact holes of one of the plurality of gate or data pad portions are arranged in a zigzag or an oblique line format; and pixel electrodes formed at the unit pixels.

This application is a Divisional of application Ser. No. 12/333,033,filed on Dec. 11, 2008 now U.S. Pat. No. 7,884,913, which claimspriority under 35 U.S.C. §119(a) to Korean Patent Application No.10-2008-0037919 filed in Republic of Korea on Apr. 23, 2008, the entirecontents of which are hereby incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a Liquid Crystal Display (LCD) device,and more particularly, to a Liquid Crystal Display (LCD) device havingcontact holes in a zigzag (or oblique line) format on pad portionsand/or varying the linewidths of the pad portions.

2. Discussion of the Background Art

A Flat Panel Display (FPD) having a light weight in a thin film shape isactively researched and commercialized for substituting a Cathode RayTube (CRT), a conventional display device, as interest and requirementsin/for an information display and a portable information medium haveincreased in the 21st century.

In the FPDs, a Liquid Crystal Display (LCD) device is actively appliedto a notebook or a desktop monitor since it implements excellentresolution, color display and definition, as a device for representingimages using an optical anisotropy of liquid crystal.

Generally, the LCD device is configured by coupling two substrates onwhich a plurality of structures including Thin Film Transistors (TFTs)are disposed, to face each other through a series of processes and thensealing them by filling with liquid crystal therebetween. Here, on anarray substrate that is a lower substrate between the two substrates,gate lines and data lines intersect with each other in a matrix formatand TFT devices each electrically connected to the corresponding pixelelectrode are provided in the intersecting region. Also, gate pads anddata pads are respectively formed at each end of the gate lines and thedata lines.

And, the gate pads and the data pads are connected to an operationcircuit. The operation circuit is electrically connected to an externalcircuit to provide data input signals, and accordingly the data signalsare separated from each other according to a control signal of theoperation circuit itself and then transferred to each pixel. Here, theoperation circuit and the data lines or the gate lines of the LCD deviceare connected to each other in a Tape Automated Bonding (TAB) methodgenerally. Here, the TAB method refers to a method of mounting a packageconnected to an operation circuit onto a substrate.

FIG. 1 is a view showing a pad portion (top plan and side views) of ageneral LCD device.

As shown in FIG. 1, each pad portion connected to each end of the gatelines and data lines includes a pad metallic film 12, an insulationlayer 17 and a transparent conductive film ITO (Indium Tin Oxide) 15.The insulation layer 17 may be implemented as a protection film 14 of asingle layer or a double film of a gate insulation film 13 and theprotection film 14. And, the pad metallic film 12 and the transparentconductive film ITO 15 contact each other at a pad open region (orcontact hole) 16.

For example, the pad metallic film 12 formed of Chrome (Cr), forexample, and the gate insulation film 13 and the protection film 14 maybe formed over the pad metallic film 12. In addition, the pad openregion 16 formed by partially etching the insulation film 13 so as toexpose a portion of the pad metallic film 12 and the transparentconductive film ITO 15 compressed on the insulation film 13 so as tocontact the pad metallic film 12 through the pad open region 16 areformed thereon in sequence. Here, the transparent conductive film ITO 15is connected to a terminal such as an IC by the TAB method.

Accordingly, the pad portion having a lower pad layer provided with thepad metallic film 12 and an upper pad layer provided with thetransparent conductive layer ITO 15 and connected to a TAB IC isprovided.

However, due to an environmental regulation, the pad metallic film 12 isconventionally formed of Molybdenum (Mo) as a substitute for Cr. As aresult, the pad metallic film 12 is mostly etched when forming the padopen region or contact hole on the pad portion formed of Mo. This causesa side contact between the transparent conductive film ITO 15 and thepad metallic film 12. The side contact means that a contacting areabetween the transparent conductive film ITO 15 and the pad metallic film12 is remarkably small. Since a contact resistance of a general padportion is determined by a portion where the transparent conductive filmITO 15 and the pad metallic film 12 contact each other, if the contactresistance is reduced due to the side contact, the properties of signalstransferred to the gate or data pad portion from the TAB IC may bedistorted.

In order to address this problem, a method for forming a plurality ofpad open regions (contact holes) on one pad portion has been proposed,which will be discussed referring to FIG. 2.

FIG. 2 is a view showing a pad portion (top plan and side views) of aLCD device having a plurality of pad open regions and FIG. 3 is a planarview showing pad portions of a LCD device having multi-holes in a stripeformat, in accordance with the related art. The pad portions paralleleach other and the contact holes are aligned to each other as shown inFIG. 3.

As shown in FIG. 2, the pad portion includes a pad metallic film 22formed of Mo on a transparent glass substrate 21 and a gate insulationfilm 23 formed on the pad metallic film 22. Here, though it is notshown, a gate line and a gate electrode are formed on the glasssubstrate 21 of a pixel region to be integral with the pad metallic film22. In addition, a gate insulation film 23 is formed at a front surfaceof the substrate including the gate line and the gate electrode.

The pad metallic film 22 is formed of Mo in a sputtering manner. And,the gate insulation film 23 is formed of inorganic substance such asSilicon Nitride (SiNx) or Silicon Oxide (SiOx) in a PECVD (PlasmaEnhanced Chemical Vapor Deposition) method.

A protection film 24 is formed on the gate insulation film 23 thus toform an insulation layer 27. The protection film 24 is formed of BCB(Benzocyclobutene) having a low permittivity.

Meanwhile, a data line and a source/drain electrode are formed on thegate insulation film 23 of the pixel region thus to form a Thin FilmTransistor (TFT) together with the gate electrode, and the protectionfilm 24 is formed at the front surface including the TFT.

By selectively removing the protection film 24 and the gate insulationfilm 23 of the pad portion, the pad metallic film 22 is partially orselectively etched and a plurality of substrate open regions 26 areformed.

And, a transparent conductive film ITO 25 over the protection film 24 soas to contact the pad metallic film 22 at the substrate open regions 26.

Accordingly, the pad metallic film 22 and the transparent conductivefilm ITO 25 contact each other through the plurality of substrate openregions 26 at the pad portion. This in turn reduces the contactresistance, which can minimize distortion of a signal being applied atthe pad portion.

As another example of the pad portion having the multi-hole structure(open regions 26), substrate open regions 36 may be formed on the sameline to be formed in the stripe format as shown in FIG. 3. Here, everypad portion 32 may have three or more substrate open regions 36.

However, in case that a photolithography process is applied to form themulti-holes in the stripe format in the related art, since a high-pricedmask is used, a fabrication cost of the pad portions may increase.

In order to address this problem, a method for fabricating a LCD deviceto which a printing method is applied has been proposed according to therelated art, which is discussed referring to FIG. 4.

FIG. 4 is a view partially showing a method for fabricating a LCD deviceto which a related art roll printing method is applied.

As shown in FIG. 4, when forming contact holes on a pad portion of theLCD device, a PR solution 45 ejected from a coater 30 is absorbed onto aroller 40 formed of polydimethylsiloxane (PDMS) and then the roller 40is rolled on a cliché, namely, a printing plate 50 having embossedpatterns 51 thus to form PR patterns 45 a on the roller 40.

Then, the PR patterns 45 a formed on the roller 40 are transferred ontoa substrate 60 on which a pad metallic film and an insulation film 61are mounted, and then contact holes (open regions) are formed by anetching process and a photo stripping process using the PR patterns 45 aon the substrate 60.

Here, it is assumed that the pad metallic film is formed at the lowerportion of the insulation film 61 on the substrate 60.

And, when forming these contact holes e.g., (open regions) on the padportion, other contact holes are also formed on a protection film of aTFT portion, simultaneously.

However, the roll printing process is not limited to the formation ofcontact holes but can be broadly applied at a time of forming gate linesincluding a gate pad metallic film and data lines including a data padmetallic film.

Further, above all, when fabricating the printing plate 50 which is tobe used to form the contact holes of the pad portion and the TFT portionformed on an array substrate of a LCD, it is difficult to form theembossed patterns 51 related to the formation of various contact holes,in consideration of a margin for obtaining a depth of the printing plate50 in a wet etching process.

As a result, when a printing process is applied with using aphotoresist, (substituting the photolithography process) in order toform the multi-holes on the pad portion in the stripe format as shown inFIG. 3 according to the related art, it is rather difficult to formthese multi-holes on the pad portions.

As an example, FIG. 5A is a view showing a structure of an “ideal”printing plate having embossed patterns in an ideal stripe format, whichcan be used in the step of forming the multi-holes on the pad portions,and FIG. 5B is a section view showing a cut portion taken along lineA-A′ in FIG. 5A. And, FIG. 6A is a view showing an example of astructure of an actual printing plate which is often used in the actualstep of forming the multi-holes on the pad portions, and FIG. 6B is asection view showing a cut portion taken along line B-B′ in FIG. 6A.

In order to allow pads adjacent to each other to have contact holesalong the same straight line (same as the photolithography process), theembossed patterns on a printing plate may be entirely formed in thestripe format as shown in FIG. 5A.

More specifically referring to FIGS. 5A and 5B, when performing the wetetching to form the embossed patterns 51 on the substrate 50, thephotoresist (PR) coated on the glass substrate 50 is coupled to theglass substrate 50 with a small coupling force. Thus, the photoresist ispartially stripped at the time of etching. Accordingly the embossedpatterns 51, which are to be used to form the contact holes (e.g., openregions) on pad portions and other portions, are not precisely formed onthe glass substrate 50.

To avoid the abovementioned limitation, when forming the embossedpatterns on the glass/printing plate 50, as shown in FIG. 5B a masklayer is mounted on an initial glass substrate 50 and a photoresist (PR)formed thereon, the PR is exposed to the light and developed inconsideration of the margin of the depth of the printing plate throughthe photolithography process, and a metallic layer is etched thus toform photoresist patterns 53 and mask patterns 52. Then the PR patterns53 and mask patterns 52 are used to form the embossed patterns 51 on theplate 50.

Here, the wet etching for forming the embossed patterns 51 on the plate50 is performed at the lower portion of the mask patterns 52 as shown inFIG. 5B. In the wet etching process, an isotropic etching phenomenon mayoccur where the embossed patterns 51 are etched in a round shape as thedepth becomes greater and simultaneously a width becomes wider, in thewet etching process. Thus, the margin of the depth of the printing plateshould be properly obtained.

Regarding this, in the related art, when the etched depth of theprinting plate 50 is approximately 40˜50 μm, it is capable of obtainingenough margin of the depth of the printing plate. Accordingly, whenforming the mask patterns 52 for forming the embossed patterns 51 having12 μm of each width in up and down and right and left, it is designed byadditionally calculating 40 μm for each width in up and down and rightand left.

However, it is assumed that a pitch between the pads (gate pads or datapads) is 60 μm and a contact hole having approximately 12 μm in width isformed on the pad portion having 26 μm in width according to the designof the data pad portion on the TFT array substrate. Then, if theprinting plate has the margin of approximately 40 μm of depth asabovementioned, the embossed patterns which are to be used to formcontact holes or open regions would not be formed properly. For example,as shown in FIGS. 6A and 6B, improper and undesirable embossed patterns51 a may be formed on a printing plate 50 a using PR patterns 53 a andmask patterns 52 a.

Hereafter, a problem or limitation generated when fabricating a TFTarray substrate using the printing plate having the structure as shownin FIGS. 6A and 6B, will be discussed referring to FIGS. 7A-7C.

FIGS. 7A to 7C are views showing processes for fabricating a TFT arraysubstrate using a printing plate 50 a having the embossed patterns 51 aas shown in FIGS. 6A and 6B according to a relate art.

As shown in FIG. 7A, when fabricating the TFT array substrate of a LCDdevice, the PR solution is not entirely or properly coated over theperiphery of the pad portions of the TFT array substrate by the embossedpatterns 51 a of the printing plate after forming a protection film 73due to the defects of the embossed patterns 51 a discussed above.Accordingly a gate insulation film 71 formed on a substrate 70 and atboth lower portions of a pad metallic film 72 formed of Mo is etched aswell as the protection film 73, i.e., under cut phenomenon occurs, whenperforming a dry etching for forming the contact holes as shown in FIG.7B.

As a result, when performing a rubbing process for the TFT arraysubstrate, protruded portions at both sides of the pad metallic film 72come off and then act as foreign substances that interfere with theother substrates/substances in the processes, which is a problem.

SUMMARY OF THE INVENTION

Therefore, a first object of the present invention is to provide aprinting plate in which disposition of embossed patterns is changed soas to form contact holes by precisely transferring PR patterns on a padmetallic film formed on a TFT array substrate at the time of a rollprinting process.

A second object of the present invention is to provide a Liquid CrystalDisplay (LCD) device having contact holes in a zigzag (or oblique line)format by having two or more pad unit portions as one set (or one padportion) by using a printing plate.

A third object of the present invention is to provide a LCD device inwhich the linewidths of the peripheral regions of contact holes and theperipheral regions of non-contact holes in each pad unit portion aredifferent from each other, where the contact holes on two or more padunit portions are arranged in a zigzag (or oblique line) format orpattern, in consideration of a minute mis-alignment which may begenerated at the time of a roll printing process, when applying theprinting plate formed according to the first object.

To achieve these and other advantages and in accordance with the purposeof the present invention, as embodied and broadly described herein, inaccordance with an aspect of the present invention, there is provided aLCD device comprising a plurality of gate lines and data linesintersecting with each other on a substrate so as to define a unitpixel, a TFT formed at the intersecting region of each of the gate linesand each of the data lines, a plurality of gate pad portions and/or datapad portions formed at end portions of the corresponding gate linesand/or the data lines, contact holes formed on the gate and/or data padportions and in a zigzag or an oblique line format by having two or morepad unit portions as one of the gate or pad portion, and a pixelelectrode formed at each unit pixel of the substrate.

In accordance with another aspect of the present invention, there isprovided a LCD device comprising a plurality of gate lines and datalines intersecting with each other on a substrate so as to define unitpixels, a TFT formed at each intersecting region of the gate lines anddata lines, a plurality of gate pad portions and/or data pad portionsformed at end portions of the gate lines and/or the data lines, whereineach of the gate and/or data pad portions has different or varyinglinewidths by being divided into a first region and a second region,contact holes formed in a zigzag format on the pad portions, and a pixelelectrode formed at each unit pixel of the substrate.

In accordance with another aspect of the present invention, there isprovided a liquid crystal display (LCD) device comprising: a pluralityof gate lines and data lines arranged on a substrate to define aplurality of unit pixels; thin film transistors (TFTs) each formed at anintersecting region of the gate lines and the data lines; a plurality ofgate pad portions and data pad portions formed at end portions of thegate lines and the data lines, respectively, at least one of the gateand data pad portions being made up of at least two pad unit portions,each pad unit portion having at least one contact hole such that thecontact holes of one of the plurality of gate or data pad portions arearranged in a zigzag or an oblique line format; and pixel electrodesformed at the unit pixels.

In accordance with another aspect of the present invention, there isprovided a method of fabricating a liquid crystal display (LCD) device,the method comprising: forming a plurality of gate lines and data linesarranged on a substrate to define a plurality of unit pixels; formingthin film transistors (TFTs) each at an intersecting region of the gatelines and the data lines; forming a plurality of gate pad portions anddata pad portions at end portions of the gate lines and the data lines,respectively, at least one of the plurality of gate and data padportions including contact holes, wherein the step of forming theplurality of gate and data pad portions includes: providing a printingplate having a predetermined pattern, the predetermined pattern being azigzag pattern or oblique line pattern, applying a roller having aphotoresist material onto the printing plate so as to transfer thepredetermined pattern of the printing plate onto the roller, andapplying the roller having the transferred predetermined pattern onto asubstrate so as to form the contact holes having a pattern correspondingto the transferred predetermined pattern on the roller; and formingpixel electrodes at the unit pixels.

The foregoing and other objects, features, aspects and advantages of thepresent invention will become more apparent from the following detaileddescription of the present invention when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate embodiments of the invention andtogether with the description serve to explain the principles of theinvention.

In the drawings:

FIG. 1 is a view showing a pad portion of a general LCD device;

FIG. 2 is a view showing a pad portion of a LCD device having aplurality of pad open regions according to the related art;

FIG. 3 is a planar view showing pad portions of a LCD device havingmulti-holes in a stripe format in accordance with the related art;

FIG. 4 is a view partially showing a method for fabricating a LCD deviceto which a related art roll printing method is applied according to therelated art;

FIG. 5A is a view exemplary showing a structure of a printing platehaving embossed patterns in an ideal stripe format in the step offorming mask patterns according to the related art;

FIG. 5B is a section view showing a cut portion taken along line A-A′ inFIG. 5A;

FIG. 6A is a view showing a structure of a printing plate applied to areal process in the step of forming the mask patterns according to therelated art;

FIG. 6B is a section view showing a cut portion taken along line B-B′ inFIG. 6A;

FIGS. 7A to 7C are views showing processes for fabricating a TFT arraysubstrate using a printing plate having the structure shown in FIGS. 6Aand 6B according to the related art.

FIG. 8A is a planar view showing a structure of a printing plate used atthe time of fabricating a LCD device in accordance with an embodiment ofthe present invention;

FIG. 8B is a section view showing a cut portion taken along line C-C′ inFIG. 8A;

FIG. 9 is a planar view showing a LCD device formed by applying theprinting plate of FIGS. 8A and 8B in accordance with a first embodimentof the present invention;

FIG. 10 is a planar view showing a LCD device in accordance with asecond embodiment of the present invention; and

FIGS. 11A to 11C are views showing variations of each structure of padportions of the LCD devices in accordance with the first and secondembodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Description will now be given in detail of the preferred embodiments ofthe present invention, with reference to the accompanying drawings.

FIG. 8A is a planar view showing a structure of a printing plate appliedat the time of fabricating a LCD device in accordance with an embodimentof the present invention, and FIG. 8B is a section view showing a cutportion taken along line C-C′ in FIG. 8A.

As shown in FIGS. 8A and 8B, embossed patterns 103 protruded on a glasssubstrate 100 (or printing plate) are formed in a zigzag (or obliqueline) format or configuration. A method for fabricating the printingplate having this structure is discussed below in more detail.

First, a mask layer formed of Mo, Cr, ITO (Indium Tin Oxide), etc. ismounted on the glass substrate 100, i.e., a base substrate.

Next, after coating a photoresist (PR) on the mask layer, a photo maskopened in the zigzag or oblique line format is developed and etched.Accordingly, mask patterns 105 and photoresist patterns 107 formed inthe zigzag or oblique line format are formed.

Thereafter, the glass substrate 100 is etched through an etching processusing the patterns 105 and 107 and etchant used for forming the maskpatterns 105 and the photoresist patterns 107, for example, HydroFluoricacid (HF) based etchant, thus to form the embossed patterns 103 in thezigzag or oblique line format and/or intaglio patterns corresponding tothe zigzag or oblique line format of the patterns 105 and 107.

And, the embossed patterns 103 formed on the glass substrate 100 in thezigzag or oblique line format are outwardly exposed by removing thephotoresist patterns 107 and the mask patterns 105. As a result, theprinting plate 100 having the embossed patterns 103 in the zigzag oroblique line format is formed.

In this case, since an isotropic etching is implemented at the time ofetching the glass substrate 100, a mask is designed in consideration ofsubstantially desired embossed patterns 103 and a degree of theisotropic etching at the time of designing the printing plate, therebyforming the photoresist patterns 107 and the mask patterns 105.

And, by forming the mask patterns 105 after mounting the mask layer onthe glass substrate 100, it is capable of preventing the etchant frompenetrating therebetween since an adhesive force between the photoresistand the mask layer or between the mask layer and the glass substrate 100is greater than the adhesive force between the photoresist and the glasssubstrate 100. Accordingly, the present invention allows preciseformation of the embossed patterns 103 at the desired positions and thusallows precise and easy formation of contact holes or other structures,formed on the pad portions of a TFT array substrate or other locations.

Furthermore, in the process for fabricating the printing plate using aroll printing process in accordance with an embodiment the presentinvention, the mask patterns 105 are wider than a width of the embossedpatterns 103 and are in the zigzag or oblique line format, and theembossed patterns are used to form the contact holes on gate padportions and data pad portions having the same pitch according to aphotolithography process. This will be determined by the photoresistremaining on the mask patterns 105.

As a result, in the process according to the present invention, forexample, when the pitch between data pad portions on the TFT arraysubstrate is 60 μm and an etched depth of the printing plate is 40 μm,it is capable of forming the embossed patterns 103 in consideration ofthe etched depth of the printing plate when fabricating the printingplate, and thus of obtaining a margin enough to form the contact holeson the TFT array substrate.

And, considering the fabrication cost after fabricating the LCD device,the printing plate having the abovementioned structure can be usefullyapplied even when the pitch between the gate pad portions or data padportions becomes shorter.

Meanwhile, regarding the printing plate according to the presentinvention, the PR solution is transferred by the embossed patterns 103of the printing plate 100 when a roller coated with the PR solution isrolled on the printing plate 100 on which the embossed patterns 103 areformed, and vice versa according to the properties of the PR solution.That is, the PR solution can be transferred by the intaglio patterns. Tothis end, the embossed patterns 103 on the glass substrate 100 areformed to have the intaglio patterns.

FIG. 9 is a planar view showing a LCD device formed by applying/usingthe printing plate of FIGS. 8A and 8B in accordance with a firstembodiment of the present invention.

As shown in FIG. 9, in a liquid crystal panel that is a basic deviceforming an LCD device, an upper color filter substrate 140 and a lowerTFT array substrate 110 face each other with a specific intervaltherebetween and liquid crystal including liquid crystal molecules isfilled therebetween. Electrodes for applying voltages to the liquidcrystal are implemented as a common electrode disposed on the colorfilter substrate 140 and pixel electrodes 123 disposed on the arraysubstrate 110. When the voltage is applied to two kinds of theelectrodes (common and pixel electrodes), a vertical electric fieldformed by a difference in the applied voltages controls a direction ofthe liquid crystal modules interposed therebetween.

According to an embodiment, the LCD device at the lower portion of itsliquid crystal panel includes a backlight device used as a light sourceand a driving unit disposed at edge portions of the liquid crystal panelso as to operate the liquid crystal panel. Here, the driving unit isimplemented on a PCB (Printed Circuit Board). The PCB is divided into agate PCB connected to gate lines 124 of the liquid crystal panel and adata PCB connected to data lines 125. Each PCB is connected to TCPs(Tape Carrier Packages) 124 c, 125 c attached to gate pad portions 124 aformed at one lateral surface of the liquid crystal panel and connectedto the gate lines 124 and data pad portions 125 a connected to datalines 125 formed at an upper side surface perpendicular with the onelateral surface on which the gate pad portions 124 a are generallyformed.

On the array substrate 110, there are the plurality gate lines 124 anddata lines 125 intersecting with each other so as to define unit pixelsformed in a matrix format, a TFT formed at an intersecting region of thegate lines 124 and data lines 125, a plurality of gate pad portions 124a and data pad portions 125 a formed respectively at end portions of thegate lines 124 and/or data lines 125, contact holes 125 b formed in azigzag (or oblique line) format on the gate pad portions 124 a and/orthe data pad portions 125 a by having two or more pad unit portions asone set (one pad portion), and the pixel electrode 123 formed at eachunit pixel of the array substrate 110. That is, each of the gate padportions 124 a and the data pad portions 125 a is preferably made up oftwo or more pad unit portions (unit strips) 127 (each pad unit portion127 having the contact holes 125 b) that are aligned to each other suchthat all the contact holes of that gate or pad portion as one set form azigzag or oblique line pattern. In FIG. 9, three pad unit portions 127are shown to compose one gate or pad portion 124 a or 125 a.

According to an embodiment, the contact holes 125 b formed in the zigzagformat on the gate pad portions 124 a and the data pad portions 125 arespectively formed at the end portions of the gate lines 124 and thedata lines 125 are formed through the roll printing process.

As described, in order to perform the roll printing process, maskpatterns are formed on the printing plate 100 in a format similar to thegate lines 124 of the array substrate 110 and/or the gate pad portions124 a formed at the end portions of the gate lines 124. Through theprinting plate, the contact holes can be formed on the gate pad portions124 a of the array substrate 110 in the zigzag format.

Similarly, through the roll printing method and the printing plate, thecontact holes 125 b can be formed on the data pad portions 125 a formedat the end portions of the data lines 125 in the zigzag format.

For example, a plurality of contact holes 125 b are formed with aspecific interval therebetween on the gate pad portions 124 and/or thedata pad portions 125 a. Here, each of the unit pad portions 127 isdivided into a first region in which the contact holes 125 b are formedand a second region between the contact holes 125 b where the contactholes 125 b are not formed. In an example, the first and second regionsalternate with each other repeatedly in each pad unit portion 127.Further the first region and the second region alternate with each otherbetween adjacent unit pad portions. As a result, the contact holes 125 bin all the first regions of each gate/data pad portion are arranged inthe zigzag format or oblique line format.

In an example of forming a LCD device, the gate electrodes of the TFTs,the gate lines 124 and the gate pad portions 124 a may be simultaneouslyformed on the same layer on the array substrate 110. And, a gateinsulation film is formed on the array substrate 110 on which the gatepad portions 124 a is formed, and semiconductor patterns of the TFTs andsource/drain electrodes are sequentially formed on the array substrate110 on which the gate insulation film is formed. And, a protection filmis formed on the array substrate 110 on which the source/drainelectrodes are formed. Here, the protection film is also formed on thegate insulation film on which the gate pad portion 124 a is formed.

Then, the PR patterns are roll-printed using the printing plate asdiscussed above. Thereafter, through an etching process for forming thecontact holes and a stripping process for removing the PR, the contactholes 125 b are formed in the zigzag format on the pad portions 124 a.

And, a transparent conductive film ITO simultaneously formed at the timeof forming the pixel electrodes 123 formed at the unit pixel region isformed at a portion where the contact holes are formed. Each gate padportion 124 a and each data pad portion 125 a are electrically connectedto an external system through the transparent conductive film ITO,thereby supplying external signals to the gate lines 124 and the datalines 125, respectively.

Here, the external system can be, e.g., a gate TCP (Tate CarrierPackage) 124 c attached to the gate pad portions 124 a and mounting agate driving IC therein, a data TCP 125 c attached to the data padportions 125 a and mounting a data driving IC therein, and a PCBgenerating all kinds of signals by being connected to the gate TCP 124 cand the data TCP 125 c.

For example, the TCP 124 c mounting the gate driving IC therein and thedata TCP 125 c mounting the data driving IC therein are attached on thearray substrate 110, thus scan signals and picture/date signals arerespectively supplied to the gate pad portions 124 a and the data padportion 125 a formed on the array substrate 110. And, various circuitssuch as a common voltage generation circuit are electrically connectedto the data TCP 125 c. The common voltage generation circuit isconnected to a common voltage line of the array substrate 110 thus toapply a common voltage (Vcom).

The roll printing method applied to form the contact holes 125 b on thegate pad portions 124 a may be equally applied at the time of formingthe contact holes 125 b in the zigzag format on the data pad portions125 a. In order to perform the roll printing process, mask patterns areformed on the printing plate in a format similar to the data lines 125of the array substrate 110 and/or the data pad portions 125 a formed atthe end portions of the data lines 125. Through the printing plate forforming contact holes of the data pad portions 125 a, the printing plateon which the mask patterns are formed, the contact holes 125 b can beformed on the data pad portions 125 a of the array substrate 110 in thezigzag format.

A color filter implementing red (R), green (G) and blue (B) colorscorresponding to the pixel electrodes 123 of the array substrate 110 isformed on a color filter substrate 140 bonded by a sealant. And, acommon electrode is formed on the color filter with facing the pixelelectrodes 123. The color filter substrate 140 includes a black matrixpartitioning the color filter. The common voltage (Vcom) is applied tothe common electrode through seal patterns formed at and on the commonvoltage line, thereby generating an electric field with pixel voltages(Vdata) of the R, G and B applied to the pixel electrodes 123.

However, in the LCD device in accordance with the first embodiment ofthe present invention, it may be desirable to more precisely control theroller at the time of the roll printing process, to avoid a minutemis-alignment. If, for some reason, the PR patterns on the roller forforming the pad contact holes are transferred to edge portions of thegate pad portions and the data pad portions due to the minutemis-alignment, the under cut phenomenon may occur again at the time ofetching to form the contact holes. In order to address theabovementioned possible limitation, the present invention provides asecond embodiment discussed below.

FIG. 10 is a planar view showing a LCD device in accordance with thesecond embodiment of the present invention.

As shown in FIG. 10, in a liquid crystal panel that is a basic deviceforming the LCD device, an upper color filter substrate 240 and a lowerTFT array substrate 210 face each other with a specific intervaltherebetween and liquid crystal including liquid crystal molecules isfilled therebetween.

Here, electrodes for applying a voltage to the liquid crystal areimplemented as a common electrode disposed on the color filter substrate240 and pixel electrodes 223 disposed on the array substrate 210. Whenthe voltage is applied to two kinds of the electrodes, a verticalelectric field formed by difference in the applied voltages controls adirection of liquid crystal molecules disposed therebetween thesubstrates 210 and 240.

The LCD device includes a backlight device disposed at the lower portionof the liquid crystal panel and used as a light source and a drivingunit disposed at edge portions of the liquid crystal panel to operatethe liquid crystal panel. Here, the driving unit is implemented on a PCB(Printed Circuit Board). The PCB is divided into a gate PCB connected togate lines 224 of the liquid crystal panel and a data PCB connected todata lines 225 of the liquid crystal panel.

Each PCB is connected to TCPs (Tape Carrier Packages) 224 c, 225 cmounted to gate pad portions 224 a formed at one lateral surface of theliquid crystal panel and connected to the gate lines 224, and data padportions 225 a connected to data lines 225 formed at an upper sidesurface perpendicular with the one lateral surface on which the gate padportions 224 a are formed.

On the array substrate 210, there are a plurality of the gate lines 224and data lines 225 intersecting with each other so as to define unitpixels formed in a matrix format, TFTs formed at intersecting regions ofthe gate lines 224 and the data lines 225, a plurality of gate padportions 224 a and data pad portions 225 a, contact holes 225 b on thegate pad portions 224 a and data pad portions 225 a, and pixelelectrodes 223 each formed at each unit pixel of the substrate.Preferably, each of the gate and data pad portions 224 a and 225 a ismade up of two or more pad unit portions 227 (each pad unit portionhaving the contact holes 225 b) aligned such that all the contact holes225 b on each pad portion 224 a or 225 a are arranged in the zigzagformat or oblique line format. Further, each pad unit portion 227includes at least one first region and at least one second regionalternating with the first region, where each first region includes onecontact hole 225 b. The linewidth (or also known as width) of the firstregion including the contact hole 225 b is wider than the linewidth ofthe second region which does not have any contact hole. An example ofsuch structure of the pad unit portions 227 forming each pad portion 224a or 225 a is shown in FIG. 10. Further, in FIG. 10, three pad unitportions 227 are shown to compose one gate or pad portion 224 a or 225a.

Further, it may be preferably that the contact holes 225 b formed in thezigzag format on the gate pad portions 224 a and the data pad portions225 a respectively formed at the end portions of the gate lines 224 andthe data lines 225 are formed through the roll printing process.

As described, in order to perform the roll printing process, maskpatterns are formed on the printing plate in a format similar to thegate lines 224 of the array substrate 210 and/or the gate pad portions224 a formed at the end portions of the gate lines 224. Through theprinting plate used for forming contact holes of the gate pad portions224 a, the printing plate on which the mask patterns are formed, thecontact holes 225 b can be formed on the gate pad portions 224 a of thearray substrate 210 in the zigzag format.

Through the same or similar roll printing method applied to form thecontact holes 225 b on the gate pad portions 224 a, the contact holes225 b can be formed on the data pad portions 225 a formed at the endportions of the data lines 225 in the zigzag format.

In one example, each of the pad unit portions for each of the gate padportions 224 a and the data pad portions 225 a is divided into at leastone first region having a large linewidth and at least one second regionhaving a small linewidth between the first regions (or next to the firstregions). Here, the contact holes 225 b are formed on the first regionhaving the large linewidth, and accordingly a plurality of contact holes225 b are formed on every unit pad portion with a constant intervaltherebetween. Further, since the first region and the second regionalternate each other between adjacent unit pad portions and in the sameunit pad portion, the contact holes 225 b on the first region are viewedto have the zigzag pattern.

In an example of forming a LCD device, the gate electrodes of the TFTs,the gate lines 224 and the gate pad portions 224 a may be simultaneouslyformed on the same layer on the array substrate 210. And, a gateinsulation film is formed on the array substrate 210 on which the gatepad portions 224 a are formed, and semiconductor patterns of the TFTsand source/drain electrodes are sequentially formed on the arraysubstrate 210 on which the gate insulation film is formed. And, aprotection film is formed on the array substrate 210 on which thesource/drain electrodes are formed. Here, the protection film is alsoformed on the gate insulation film on which the gate pad portions 224 aare formed.

Then, the PR patterns are roll-printed using the printing plate.Thereafter, through an etching process for forming the contact holes anda stripping process for removing the PR, the contact holes are formed inthe zigzag format for each gate and data pad portion as discussed above.

And, a transparent conductive film ITO simultaneously formed at the timeof forming the pixel electrodes 223 formed at each unit pixel region isformed at a portion where the contact holes are formed. Each gate padportion 224 a and each data pad portion 225 a are electrically connectedto an external system through the transparent conductive film ITO,thereby supplying external signals to the gate lines 224 and the datalines 225, respectively.

Here, the external system can be a gate TCP (Tate Carrier Package) 224 cattached to the gate pad portions 224 a and mounting a gate driving ICtherein, a data TCP 225 c attached to the data pad portions 225 a andmounting a data driving IC therein, and a PCB generating all kinds ofsignals by being connected to the gate TCP 224 c and the data TCP 225 c.

That is, the TCP 224 c mounting the gate driving IC therein and the dataTCP 225 c mounting the data driving IC therein are attached on the arraysubstrate 210, thus scan signals and picture signals are respectivelysupplied to the gate pad portions 224 a and the data pad portion 225 aformed on the array substrate 210. And, various circuits such as acommon voltage generation circuit are electrically connected to the dataTCP 225 c. The common voltage generation circuit is connected to acommon voltage line of the array substrate 210 thus to apply a commonvoltage (Vcom).

The roll printing method applied to form the contact holes 225 b on thegate pad portions 224 a may be equally applied at the time of formingthe contact holes 225 b in the zigzag format on the data pad portions225 a. In order to perform the roll printing process, mask patterns areformed on the printing plate in a format similar to the data lines 225of the array substrate 210 and/or the data pad portions 225 a formed atthe end portions of the data lines 225. Through the printing plate forforming contact holes of the data pad portions 225 a, the printing plateon which the mask patterns are formed, the contact holes 225 b can beformed on the data pad portions 225 a of the array substrate 210 in thezigzag format as discussed above.

A color filter implementing red (R), green (G) and blue (B) colorscorresponding to the pixel electrodes 223 of the array substrate 210 isformed on a color filter substrate 240 bonded by a sealant. And, acommon electrode is formed on the color filter with facing the pixelelectrodes 223. The color filter substrate 240 includes a black matrixpartitioning the color filter. The common voltage (Vcom) is applied tothe common electrode through seal patterns formed at and on the commonvoltage line, thereby generating an electric field with pixel voltages(Vdata) of the R, G and B applied to the pixel electrodes 223.

Hereafter, each structure of pad portions (gate and/or data padportions) of LCD devices in accordance with the first embodiment and thesecond embodiment of the present invention will be explained withreference to the examples of FIGS. 11A to 11C.

As shown in FIGS. 11A to 11C, according to an example of the presentinvention, the present invention provides forming the same contact holeor two or more contact holes on every pad portion (or pad unit portion),or forming contact holes different from each other in number on everypad portion (or pad unit portion). An appropriate printing plate havingthe corresponding patterns may be used.

Here, the contact holes formed on one pad unit portion and the contactholes formed on another pad unit portion adjacent to the one pad unitportion are disposed on different lines. That is, the first region inwhich the contact holes are formed and the second region in which thecontact holes are not formed should be formed to intersect with eachother.

Accordingly, it enables the pitch between the pad portions to be smallerat the time of the roll printing process. Accordingly it is capable ofreducing the number of the TCP attached on the pad portions, therebyreducing the fabrication cost.

Meanwhile, the contact holes formed in the zigzag format on the padportions of the LCD devices in accordance with the first and secondembodiments of the present invention are not limited to the rollprinting process. For example, the formation of contact holes in thezigzag format according to the present invention can be applied to thephotolithography process or other suitable processes.

In addition, in order to reduce the fabrication cost at the time offabricating the LCD device, the present invention reduces the number ofTCPs attached onto the pad portions of the TFT array substrate. That is,in order to reduce the number of TCPs, the interval between the gate padportions and the data pad portions is preferably shortened.

Here, when the interval between the pad portions shortened, the couplingforce between the photoresist coated at a space between the pad portionsand the gate insulation film or protection film is relatively weakened,thereby generating a peeling phenomenon causing even the photoresist tobe peeled away at the time of developing process for forming the contactholes.

According to the present invention, a contact area between thephotoresist and the gate insulation film or protection film is large.Accordingly it is capable of performing even the photolithographyprocess by designing the mask which allows to form the contact holes inthe zigzag format on the TFT array substrate or other suitablesubstrate.

Accordingly, the present invention prevents a part of the metallic filmat edge portions forming the pad portions in the rubbing process frombeing come away at the time of forming the contact holes on the gate anddata pad portions of the LCD device using the roll printing process.Accordingly inferior panels caused by foreign substances during the cellprocess can be reduced, thereby increasing a yield of the product.

The foregoing embodiments and advantages are merely exemplary and arenot to be construed as limiting the present disclosure. The presentteachings can be readily applied to other types of apparatuses. Thisdescription is intended to be illustrative, and not to limit the scopeof the claims. Many alternatives, modifications, and variations will beapparent to those skilled in the art. The features, structures, methods,and other characteristics of the exemplary embodiments described hereinmay be combined in various ways to obtain additional and/or alternativeexemplary embodiments.

As the present features may be embodied in several forms withoutdeparting from the characteristics thereof, it should also be understoodthat the above-described embodiments are not limited by any of thedetails of the foregoing description, unless otherwise specified, butrather should be construed broadly within its scope as defined in theappended claims, and therefore all changes and modifications that fallwithin the metes and bounds of the claims, or equivalents of such metesand bounds are therefore intended to be embraced by the appended claims.

What is claimed is:
 1. A liquid crystal display (LCD) device comprising:a plurality of gate lines and data lines arranged on a substrate todefine a plurality of unit pixels; thin film transistors (TFTs) eachformed at an intersecting region of the gate lines and the data lines; aplurality of gate pad portions and data pad portions formed at endportions of the gate lines and the data lines, respectively, at leastone of the gate and data pad portions being made up of at least two padunit portions, each pad unit portion having at least one contact holesuch that the contact holes of one of the plurality of gate or data padportions are arranged in a zigzag or an oblique line format; and pixelelectrodes formed at the unit pixels.
 2. The LCD device of claim 1,wherein each of the at least two pad unit portions includes at least onefirst region having at least one contact hole, and at least one secondregion adjacent to the at least one first region and excluding anycontact hole.
 3. The LCD device of claim 1, wherein each of the at leasttwo pad unit portions has a uniform linewidth throughout that pad unitportion.
 4. The LCD device of claim 3, wherein all of the at least twopad unit portions have the same linewidth.
 5. The LCD device of claim 3,wherein each of the at least two pad unit portions has a single contacthole, and no two adjacent contact holes are aligned to each other. 6.The LCD device of claim 3, wherein a number of contact holes present ineach of the at least two pad unit portions vary.
 7. The LCD device ofclaim 1, wherein each pad unit portion has a varying linewidththroughout that pad unit portion.
 8. The LCD device of claim 1, whereineach of the at least two pad unit portions has at least one first regionhaving a contact hole and a first linewidth, and at least one secondregion excluding a contact hole and a second linewidth less than thefirst linewidth.
 9. The LCD device of claim 8, wherein each of the atleast two pad unit portions has a pair of protrusions at opposite sidesof that pad unit portion.
 10. The LCD device of claim 9, wherein each ofthe at least two pad unit portions has a plurality of pairs of theprotrusions disposed at regular intervals.
 11. The LCD device of claim10, wherein the plurality of pairs of protrusions of the at least one ofthe gate and pad portions form a zigzag pattern or oblique lines.